2024
C. Dunlap, C. Li, H. Pandey, Y. Sun, and H. Hu, “A Temporal-Spatial Framework for Efficient Heat Flux Monitoring of Transient Boiling,” IEEE Trans. Instrum. Meas., (2024). [link]
H. Pandey, X. Du, E. Weems, S. Pierson, A. Al-Hmoud, Y. Zhao, and H. Hu, “Two-Phase Immersion Cooler for Medium-Voltage Silicon Carbide MOSFETs,” in 2024 IEEE ITherm Conference, May 2024, Denver, CO. [link]
C. Milam, C. Joshi, S. Pierson, H. Hu, and Y. Sun, “Measurement of Out-of-Plane Thermal Conductivity Using Steady-State Heat Conduction,” in 2024 ASEE Midwest Section Conference, Sep 2024, Lawrence, KS, 10.18260/1-2-1139-4935. [link]
C. Joshi, C. Milam, C. Russ, S. Pierson, H. Hu, and Y. Sun, “Development and Calibration of a Thermal Resistance Testing Facility,” in 2024 ASEE Midwest Section Conference, Sep 2024, Lawrence, KS, 10.18260/1-2-1139-49352. [link]
Dunlap, C. Li, H. Pandey, N. Le, and H. Hu, “BubbleID: A Deep Learning Framework for Bubble Interface Dynamics Analysis,” Journal of Applied Physics, 136, 014902 (2024). [link]
Pandey, C. Li, and H. Hu, “Multimodal Boiling Dataset with Synchronized Acoustic, Optical, and Thermal Measurements Under Steady-State and Transient Heat Loads,” Data Brief, 55, 110582 (2024). [link]
J. Frankhouse, C. Li, and H. Hu, “Acoustic Characterization of Integrated Circuits During Operation,” J. Electro. Packag., 146, 041103 (2024). [link]
Olabiyi, H. Pandey, H. Hu, and A. Iquebal, “A Bayesian Spatio-Temporal Modeling Approach to the Inverse Heat Conduction Problem,” J. Heat Mass Transf., 146 (9), 091403 (2024). [link]
Pandey, H. Mehrabi, A. Williams, C. Mira-Hernández, R. H. Coridan, and H. Hu, “Acoustic Sensing for Investigating Critical Heat Flux Enhancement During Pool Boiling on Electrodeposited Copper Foams,” Appl. Therm. Eng., 236, 121807 (2024). [link]
F. Al-Hindawi, Md. Siddiquee, T. Wu, H. Hu, and Y. Sun, “Domain-knowledge Inspired Pseudo Supervision (DIPS) for unsupervised image-to-image translation models to support cross-domain classification,” Eng. Appl. Artif. Intell., 127, Part A (2024) 107255. [link]
2023
J. Frankhouse, J. Marsh, and H. Hu, “Condition Monitoring of Semiconductors Using Wide Band Acoustic Emission Sensors,” in Proceedings of the ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, 2023, p. V001T02A009. [link]
J. Hoskins, H. Hu, and M. Zou, “Exploring Machine Learning and Machine Vision in Femtosecond Laser Machining,” ASME Open J. Engineering, 2 (2023) 024501. [link]
A. Williams, S. Zhou, B. Xu, and H. Hu, “Hydrogel-Coated Mesh for High-Efficiency, Ultra-Fast Oil-Water Separation,” in Proceedings of the ASME 2023 17th International Conference on Energy Sustainability, Jul 2023, Washington, DC, ES2023-106938. [link]
R. Olabiyi, H. Pandey, H. Hu, and A. Iquebal, “A Bayesian Spatio-Temporal Modeling Approach to the Inverse Heat Conduction Problem,” in Proceedings of the ASME 2023 Summer Heat Transfer Conference, Jul 2023, Washington, DC, HT2023-107671. [link]
C. Dunlap, H. Pandey, J. Marsh, E. Weems, and H. Hu, “Remote Thermal Measurements with Regression of Acoustic Emissions,” in Proceedings of the ASME 2023 Heat Transfer Summer Conference, Jul 2023, Washington, DC, HT2023-106939. [link]
Pandey, C. Dunlap, A. Williams, J. Marsh, and H. Hu, “Multimodal Characterization of Steady-State and Transient Boiling Heat Transfer,” in Proceedings of the ASME 2023 Heat Transfer Summer Conference, Jul 2023, Washington, DC, HT2023-106015. [link]
S. Chatterjee, D. Paras, H. Hu, and M. Chakraborty, “Review of Nano and Microscale Heat Transfer: An Experimental and Molecular Dynamics Perspective,” Processes, 11 (2023) 2769. [link]
C. Joshi, S. Pierson, J. Minnick, C. Russ, and H. Hu, “Integration of Metal Additive Manufacturing Using Fused Deposition Modeling in Mechanical Engineering Education,” in 2023 ASEE Midwest Section Conference, Sep 2023, Lincoln, NE, 10.18260/1-2-1139-46380. [link]
S. Pierson, L. Marshall, L. Lemmons, L. Efird, W. Shou, and H. Hu, “Work-in-Progress: Open-Source Selective Laser Sintering (SLS) Test Bed,” in 2023 ASEE Midwest Section Conference, Poster Paper, Sep 2023, Lincoln, NE, 10.18260/1-2-1139-46346. [link]
J. Mora Sánchez, Ethan Weems, and H. Hu, “Coupled Field-Driven Design and Numerical Simulation for Engineering Education,” in 2023 ASEE Midwest Section Conference, Sep 2023, Lincoln, NE, 10.18260/1-2-1139-46377. [link]
T. Harris, S. Pierson, H. Pandey, and H. Hu, “Data Acquisition Using LabVIEW and MATLAB for Mechanical Engineering Laboratories,” in 2023 ASEE Midwest Section Conference, Sep 2023, Lincoln, NE, 10.18260/1-2-1139-46375. [link]
S. Pierson, B. Fleming, and H. Hu, “CAM and Design for Manufacturing: A Project-Based Learning Course,” in 2023 ASEE Annual Conference, Jun 2023, Baltimore, MD, 39969. [link]
Y. Xu, B. Zhao, S. Tung, and H. Hu, “Infusing Data Science into Mechanical Engineering Curriculum with Course-Specific Machine Learning Modules,” in 2023 ASEE Annual Conference, Jun 2023, Baltimore, MD, 38680. [link]
H. Hu, H. Pandey, and C. Dunlap, “Detecting or Predicting System Faults in Cooling Systems in a Non-Intrusive Manner Using Deep Learning,” Jun 22, 2023, US Patent Application US2023/0195094 A1. [link]
S. Pierson, N. Nawar, and H. Hu, “Comparing the Heat Removal Efficiency of Microchannel Heat Sinks Produced by CNC Milling Versus Powder Bed Fusion” in ASTFE 8th Thermal and Fluids Engineering Conference, March, 26-29, 2023, College Park, MD, TFEC-2023-45992, p. 1249-1259. [link]
F. Al-Hindawi, T. Soori, H. Hu, M. Siddiquee, H. Yoon, T. Wu, and Y. Sun, “A Framework for Generalizing Critical Heat Flux Detection Models Using Unsupervised Image-to-Image Translation,” Expert Syst. Appl., 227 (2023) 120256. [link]
C. Dunlap, H. Pandey, E. Weems, and H. Hu, “Nonintrusive Heat Flux Quantification Using Acoustic Emissions During Pool Boiling,” 228, 120558, 2023. [link]
M. Farias, H. Hu, S. Zhang, J. Li, and B. Xu, “A molecular dynamic study of atomic diffusion effects on thermomechanical properties applying laser additive alloying process for the Cantor High Entropy Alloy,” J. Manuf. Process., 19, 149-166, 2023, [link]
D. Datta, A. Agarwal, H. Hu, M. Chakraborty, and S. DasGupta, “Early Stage Liquid Infiltration in Nano-confinements,” Langmuir, 2023, [link]
2022
H. Hu and C. Heo, “Integration of Data Science into Thermal-Fluids Engineering Education”, in Proceedings of the ASME 2022 International Mechanical Engineering Congress and Exposition, Oct – Nov 2022, Columbus, OH, IMECE2022-88193. [link]
C. Dunlap, S. Featherstone, M. Smith, M. Vu, A. Williams, J. Bailey, and H. Hu, “Design and Fabrication of A Low-Cost and Programmable Dip Coating Machine,” HardwareX, 12, e00364, 2022. [link]
R. Kumar, Trina Dhara, H. Hu, and M. Chakraborty, “Visualization-Based Prediction of Dendritic Copper Growth in Electrochemical Cells using Convolutional Long Short-Term Memory,” Energy and AI, 100203, 2022. [link]
J. Marsh, C. Dunlap, S. Pierson, and H. Hu, “Introducing LabVIEW and Arduino as Data Acquisition System Alternatives,” Paper presented at 2022 ASEE Midwest Section Conference, Tulsa, Oklahoma. 10.18260/1-2-1139-45188. [link]
A. Williams, H. Pandey, and H. Hu, “Microscopic and Video-Based Optical Techniques in Engineering Education,” Paper presented at 2022 ASEE Midwest Section Conference, Tulsa, Oklahoma. 10.18260/1-2-1139-45193. [link]
S. Pierson, J. Goss, and H. Hu, “Enhancing Undergraduate Mechanical Engineering Education with CAM and CNC Machining,” Paper presented at 2022 ASEE Midwest Section Conference, Tulsa, Oklahoma. 10.18260/1-2-1139-45200. [link]
C. Dunlap, J. Pummill, and H. Hu, “Infusing High-Performance Computing and Machine Learning in Mechanical Engineering Education,” Paper presented at 2022 ASEE Midwest Section Conference, Tulsa, Oklahoma. 10.18260/1-2-1139-45187. [link]
C. Dunlap, H. Pandey, and H. Hu, “Supervised and Unsupervised Learning Models for Detection of Critical Heat Flux During Pool Boiling,” in Proceedings of the ASME 2022 heat Transfer Summer Conference, HT2022-85582. [link]
H. Pandey, W. Waldo, and H. Hu, “Non-Intrusive Cooling System Fault Detection and Diagnostics Using Acoustic Emission,” in Proceedings of the ASME 2022 heat Transfer Summer Conference, HT2022-85429. [link]
M. Bongarala, H. Hu, J.A. Weibel, and S.V. Garimella, “Microlayer evaporation governs heat transfer enhancement during pool boiling from microstructured surfaces,” Applied Physics Letters, 120, 221602, 2022. [link]
A. Rokoni, L. Zhang, T. Soori, H. Hu, T. Wu, and Y. Sun, “Learning new physical descriptors from reduced-order analysis of bubble dynamics in boiling heat transfer,” International Journal of Heat and Mass Transfer 186, 122501, 2022
M. Bongarala, H. Hu, J.A. Weibel, and S.V. Garimella, “A figure of merit to characterize the efficacy of evaporation from porous microstructured surfaces,” International Journal of Heat and Mass Transfer 182, 121964, 2022.
2021
M. Farias, H. Hu, S. Zhang, J. Li, and B. Xu, “Molecular Dynamic Simulation of Diffusion in the Melt Pool in Laser Additive Alloying Process of Co-Ni-Cr-Mn-Fe High Entropy Alloy,” American Society of Mechanical Engineers International Mechanical Engineering Congress and Exposition, 2021, IMECE2021-72075.
S.M. Rassoulinejad-Mousavi, F. Al-Hindawi, T. Soori, A. Rokoni, H. Yoon, H. Hu, T. Wu, and Y. Sun, “Deep learning strategies for critical heat flux detection in pool boiling,” Applied Thermal Engineering 190, 116849, 2021.
Y. Sun, M. McCarthy, Y.I. Cho, P. Boettcher, H. Hu, B. Shi, Q. Xie, and K. Zammit, “Systems and methods of using phase change material in power plants,” US Patent 10,890,383, 2021.
2020
H Hu, JA Weibel, SV Garimella, “Role of nanoscale roughness in the heat transfer characteristics of thin film evaporation,” International Journal of Heat and Mass Transfer 150, 119306, 2020.
H. Hu, J.A. Weibel, and S.V. Garimella, “A coupled wicking and evaporation model for prediction of pool boiling critical heat flux on structured surfaces,” International Journal of Heat and Mass Transfer 136, 373-382, 2019.